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Optical Interconnects: "Thinking Inside of the Box" (Forum Report)

(October 2004, 70 pages - Download)

This report presents the necessary background material, conclusions drawn from the workshop, and contains key recommendations for both industry and government in order to advance the prospects for the development and incorporation of optical interconnects for box-to-box, board-to-board, chip-to-chip, and on-chip applications.

Price: $295.00

OIDA Communication Workshops at OFC/NFOEC 12